Semiconductor
Test Probes

Deringer-Ney manufactures custom-designed Probes solutions in state-of-the-art manufacturing facilities, delivering greater value at a lower cost. Our alloys uniquely provide increased performance for increased probe reliability even during high temperatures and increased workloads. As an ISO-certified manufacturer and leading alloy developer, Deringer-Ney manufactures Probes that give probe cards the cost-benefit end customers require: optimizing increased touchdowns over the life of the probe.

Probes

Types of Probes

Cobra
Cantilever
Straight
Vertical

Manufacturing

Cobra Machine
Etching

Paliney 25 Cobra Probe Brochure

Manufacturing Probes that give probe cards the cost-benefit end customers require: optimizing increased touchdowns over the life of the probe.

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Design Options

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Cut-offs

Materials Used

Paliney and Neyoro Family of Alloys

Dimensions

Diameter: 30.5 µm ( 0.0012 inches ) and up
Length: 30mm – 914.4 mm ( 1.1811 – 36 inches )

Foils

Foils offer a flexibility other formed products cannot provide. The Deriney Foil is manufactured to meet world class standards in semiconductor and medical applications. These foils are manufactured from the same alloys designed and casted at Deringer-Ney. As for performance, you can expect similar physical and mechanical properties as in wire forms. With thicknesses ranging from 16µm and higher, use for these foils can be found in probe cards, neuro stimulator stints, sensors and industrial applications.

Materials Used

Dimensions

Thickness: 16 µm-100 µm (0.00062 – 0.0039 inches)
Width: 10 cm (3.937 inches)
Length: customer specified

Advanced Semiconductor Test Alloys

Deringer-Ney is a custom manufacturer of precious metal wire, fine wire, rod, and strip using our world renowned Paliney®, Neyoro™, and Deriney™ alloys. We melt, cast, process, and spool in various tempers and sizes.

Paliney 25

Mechanical
Properties

Hardness: HK50 400
Elongation: 10%
Elastic Modulus: 135 GPa (19.6 Msi)
UTS: 1240 MPa (180 ksi)

Physical
Properties

Conductivity: 28% IACS
Resistivity: 6.3 µΩ-cm

Paliney 7

Mechanical
Properties

Hardness: HK50 260
Elongation: 10%
Elastic Modulus: 117.2 GPa (17 Msi)
UTS: 861 MPa (125 ksi)

Physical
Properties

Conductivity: 5.5% IACS
Resistivity: 210 Ω-cm

Paliney H3C

Mechanical
Properties

Hardness: HK50 390
Elongation: 3%
Elastic Modulus: 1.20 GPa (17.5 Msi)
UTS: 1,516 MPa (220 ksi)

Physical
Properties

Conductivity: 14% IACS
Resistivity: 12.3 µΩ-cm

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