Paliney H3C

General Alloy Overview

ASTM

Application Examples

Semiconductor Test Probes, Cobra Probes, Cantelever Probes, Pogo Pin Tips

Industry Examples

Semiconductor

Tempers

Annealed, Cold Worked, HT Temper, HTA Temper, HTB Temper, HTC Temper, HTD and F9 HTD Temper

Available Forms

Strip, Wire, Foil

Constant (Temper - Independent) Properties

ParameterValue
Solidus, °F (°C)1753 (956)
Liquidus, °F (°C)1920 (1049)
Melting Range, °F (°C)167 (93)
Density gram / cm3 (dwt / in3)10.39 (109.6)
Temperature Coefficent of Resistance, /°F (/K)1.2E-03 (2.1E-03)
Coefficient of Thermal Expansion, /°F (/K)8.3E-06 (1.5E-05)
Thermal EMF vs. Pt, µV/°F (µV/°C)-2.6E-03 (-4.7E-03)
Specific Heat Capacity, Btu/lb-°F (J/g-K)0.074 (0.310)
ParameterValue
Elastic Modulus, Msi (GPa)17.7 (122)
Shear Modulus, Msi (GPa)6.47 (44.6)
Poisson's Ratio0.366
Single Phase/MultiphaseMultiphase
Emissivity0.257
Tin adhesion out of 31.7
Contact resistance (Cres), 30 gf, mΩ4
Cres, oxidized 1,000h@150°C, 30 gf, mΩ14
Cres, flowers of sulfur 720h@50°C, 30gf, mΩ19

Temper Dependent Properties

Material Tested: Fine and Intermediate Wire

AnnealedCold WorkedHT TemperHTA TemperHTB TemperHTC TemperHTD and F9 TemperSC
Proportional Limit, ksi (MPa)-193 (1330)-----222 (1530)
0.2% Offset Yield Strength, ksi (MPa)152 (1050)210 (1450)218 (1500)210 (1450)202 (1390)239 (1650)217 (1500)228 (1570)
Ultimate Tensile Strength, ksi (MPa)160 (1100)231 (1590)225 (1550)216 (1490)207 (1430)247 (1700)237 (1600)234 (1610)
Elongation (% in 2")172222222
Knoop Microhardness320455425476420455425440
Vickers Microhardness320465435485445465420415
Bend Formability - Good Way, min. R/T-----<0.67--
Bend Formability - Bad Way, min. R/T-----<0.5--
Electrical Resistivity, µΩ-cm221913121111212
Electrical Conductivity, %IACS89141415161214
Thermal Conductivity, W/m-K33375458626635758

Material Tested: Strip

AnnealedCold WorkedHT TemperHTA TemperHTB TemperHTC TemperHTD and F9 TemperSC
Proportional Limit, ksi (MPa)--------
0.2% Offset Yield Strength, ksi (MPa)--------
Ultimate Tensile Strength, ksi (MPa)------218 (1500)-
Elongation (% in 2")------2-
Knoop Microhardness------425-
Vickers Microhardness------420-
Bend Formability - Good Way, min. R/T--------
Bend Formability - Bad Way, min. R/T--------
Electrical Resistivity, µΩ-cm--------
Electrical Conductivity, %IACS------12-
Thermal Conductivity, W/m-K-------

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