Paliney H3C

General Alloy Overview

ASTM

N/A

Application Examples

Electrical Contacts

Industry Examples

Semiconductor

Tempers

Age Hardened, Annealed

Availible Forms

Wire

Temper Independent Properties

ParameterValueValue 2
Solidus, °F (°C)1750(950)
Liquidus, °F (°C)1920(1050)
Melting Range, °F (°C)170(100)
Density, dwt/in³­ (g/cm³)110(10.4)
Specific Heat Capacity, Btu/lb·°F, (J/g·K)0.068(0.29)
Coefficient of Thermal Expansion, /°F (/K)8.3×10-6(1.5×10-5)
Thermal EMF vs Pt, μV/°F (μV/°C)-2.6×10-3(-4.7×10-3)
Emissivity0.26
ParameterValueValue 2
Thermal Conductivity, Btu/hr·ft·°F (W/m·k)
Temperature Coefficient of Resistance, /°F (/K)1.2×10-3(2.1×10-3)
Electrical Resistivity, Ω·cmf (µΩ·cm)
Electrical Conductivity, %IACS14 (‡)
Elastic Modulus, Msi (GPa)17.7(122)
Shear Modulus, Msi (GPa)6.47(44.6)
Poissons Ratio0.366
Nobility, %40

Temper Dependent Properties

Age Hardened (HT Temper) - Wire - Cut Length 0.002 - 0.050 in. (0.05 - 1.25 mm) diameter

ParameterNominalMin
NominalMin
0.2% Offset Yield Strength, ksi (MPa)(N/A)
Tensile Elongation to Failure, %2(N/A)
Vickers Microhardness, HV(N/A)
ParameterNominalMin
NominalMin
Ultimate Tensile Strength, ksi (MPa)225 (1550)220 (1500)
Knoop Microhardness, HK450425

Age Hardened (DHT Temper) - Wire - Spool 0.002 - 0.020 in. (0.05 - 0.5 mm) diameter

ParameterNominalMin
NominalMin
0.2% Offset Yield Strength, ksi (MPa)230 (1585)(N/A)
Tensile Elongation to Failure, %2(N/A)
Vickers Microhardness, HV(N/A)
ParameterNominalMin
NominalMin
Ultimate Tensile Strength, ksi (MPa)240 (1650)200 (1380)
Knoop Microhardness, HK425370

Annealed - Wire - Spool 0.005 - 0.040 in. (0.15 - 1.0 mm) diameter

ParameterNominalMin
NominalMin
0.2% Offset Yield Strength, ksi (MPa)150 (1035)(N/A)
Tensile Elongation to Failure, %175
Vickers Microhardness, HV320(N/A)
ParameterNominalMin
NominalMin
Ultimate Tensile Strength, ksi (MPa)170 (1170)120 (830)
Knoop Microhardness, HK285270

† - Values containing † are available upon request

‡ - Values containing (‡) only apply to age hardened conditions

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