N/A
Integrated circuit test pins; MEMS probes; vertical probes; laser cutting foils
Semiconductor
Thin strip and foil, HTA
Strip and Foil
Parameter | Value |
---|---|
Solidus, °F (°C) | 1985 (1085) |
Liquidus, °F (°C) | 2116 (1158) |
Melting Range, °F (°C) | 131 (73) |
Density, dwt/in3 (g/cm3) | 112.60 (10.685) |
Temperature Coefficent of Resistance, /°F (/K) | 7.69E-04 (1.23E-03) |
Specific Heat Capacity, Btu/lb-°F, (J/g-K) | 0.069 (0.289) |
Elastic Modulus, MSI, (GPa) | 19.6 (135) |
Parameter | Value |
---|---|
Shear Modulus, Msi (GPa) | 7.2 (50) |
Poisson's Ratio | 0.36 |
Single phase/multiphase | Two-phases: FCC and HCP |
Contact Resistance (Cres), 30 gf, mΩ | 10 |
Cres, oxidized 1,000h@150°C, 30 gf, mΩ | 5 |
Cres, flowers of sulfur 720h@50°C, 30gf, mΩ | 450 |
Parameter | Value |
---|---|
Proportional Limit, ksi (MPa) | 165 (1120) |
0.2% Offset Yield Strength, ksi (MPa) | 174 (1190) |
Ultimate Tensile Strength, ksi (MPa) | 205 (1400) |
Elongation to Failure, % | 4 |
Electrical Resistivity, Ω-cmf (µΩ-cm) | 43.2 (7.18) |
Electrical Conductivity, %IACS | 24 |
Thermal Conductivity, (Btu/hr-ft-°F) W/m-k | 57.6 (99.6) |
Parameter | Value |
---|---|
Knoop Microhardness, HK | 460 |
Vickers Microhardness, HV | 460 |
Knoop Microhardness after 1kh@250°C, HK | 440 |
Hot Ultimate Tensile Strength @250°C, Ksi (MPa) | 187 (1270) |
Hot Knoop Microhardness @250°C, % | 3 |
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