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Paliney 23

General Alloy Overview

ASTM

N/A

Application Examples

Semiconductor Test Probes

Industry Examples

Semiconductor, Industrial, Automotive, Aerospace, and Defense

Tempers

Age Hardened

Availible Forms

Strip

Temper Independent Properties

ParameterValueValue 2
Solidus, °F (°C)1985(1085)
Liquidus, °F (°C)2115(1160)
Melting Range, °F (°C)130(75)
Density, dwt/in³­ (g/cm³)112(10.6)
Specific Heat Capacity, Btu/lb·°F, (J/g·K)0.069(0.29)
Coefficient of Thermal Expansion, /°F (/K)†
Thermal EMF vs Pt, μV/°F (μV/°C)†
Emissivity†
ParameterValueValue 2
Thermal Conductivity, Btu/hr·ft·°F (W/m·k)63(110)
Temperature Coefficient of Resistance, /°F (/K)†
Electrical Resistivity, Ω·cmf (µΩ·cm)43(7.2)
Electrical Conductivity, %IACS24
Elastic Modulus, Msi (GPa)19.6(135)
Shear Modulus, Msi (GPa)7.2(50)
Poissons Ratio0.36
Nobility, %52.5

Temper Dependent Properties

Age Hardened (HTA Temper) - Strip 0.0004 - 0.005 in. (0.01 - 0.125 mm) thickness

ParameterNominalMin
NominalMin
0.2% Offset Yield Strength, ksi (MPa)175 (1200)170 (1170)
Tensile Elongation to Failure, %31.5
Vickers Microhardness, HV465440
ParameterNominalMin
NominalMin
Ultimate Tensile Strength, ksi (MPa)215 (1475)195 (1345)
Knoop Microhardness, HK†440

† - Values containing † are available upon request

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