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Paliney 35

General Alloy Overview

ASTM

N/A

Application Examples

Semiconductor Test Probes
Electrical Contacts

Industry Examples

Semiconductor, Industrial,
Automotive, Aerospace, and Defense

Tempers

Age Hardened

Availible Forms

Wire

Temper Independent Properties

ParameterValueValue 2
Solidus, °F (°C)2085(1140)
Liquidus, °F (°C)2175(1190)
Melting Range, °F (°C)9050
Density, dwt/in³­ (g/cm³)110(10.5)
Specific Heat Capacity, Btu/lb·°F, (J/g·K)0.071(0.298)
Coefficient of Thermal Expansion, /°F (/K)†
Thermal EMF vs Pt, μV/°F (μV/°C)†
Emissivity†
ParameterValueValue 2
Thermal Conductivity, Btu/hr·ft·°F (W/m·k)79(140)
Temperature Coefficient of Resistance, /°F (/K)9.4×10-4(1.7×10-3)
Electrical Resistivity, Ω·cmf (µΩ·cm)31(5.2)
Electrical Conductivity, %IACS33 (‡)
Elastic Modulus, Msi (GPa)20(140)
Shear Modulus, Msi (GPa)7.90(50.3)
Poissons Ratio0.360
Nobility, %55.5

Temper Dependent Properties

Age Hardened (HTS Temper) - Wire - Spool 0.002 - 0.010 in. (0.05 - 0.25 mm) diameter

ParameterNominalMin
NominalMin
0.2% Offset Yield Strength, ksi (MPa)150 (1030)130 (900)
Tensile Elongation to Failure, %2518
Vickers Microhardness, HV350(N/A)
ParameterNominalMin
NominalMin
Ultimate Tensile Strength, ksi (MPa)200 (1380)170 (1170)
Knoop Microhardness, HK340335

Age Hardened (HTSC Temper) - Wire - Spool 0.002 - 0.010 in. (0.05 - 0.25 mm) diameter

ParameterNominalMin
NominalMin
0.2% Offset Yield Strength, ksi (MPa)160 (1130)130 (900)
Tensile Elongation to Failure, %2418
Vickers Microhardness, HV360335
ParameterNominalMin
NominalMin
Ultimate Tensile Strength, ksi (MPa)200 (1380)170 (1170)
Knoop Microhardness, HK350335

† - Values containing † are available upon request​​

‡ - Values containing (‡) only apply to age hardened conditions ​

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