Paliney 23

General Alloy Overview

ASTM

N/A

Application Examples

Integrated circuit test pins; MEMS probes; vertical probes; laser cutting foils

Industry Examples

Semiconductor

Tempers

Thin strip and foil, HTA

Availible Forms

Strip and Foil

Constant (Temper - Independent) Properties

ParameterValue
Solidus, °F (°C)1985 (1085)
Liquidus, °F (°C)2116 (1158)
Melting Range, °F (°C)131 (73)
Density, dwt/in3 (g/cm3)112.60 (10.685)
Temperature Coefficent of Resistance, /°F (/K)7.69E-04 (1.23E-03)
Specific Heat Capacity, Btu/lb-°F, (J/g-K)0.069 (0.289)
Elastic Modulus, MSI, (GPa)19.6 (135)
ParameterValue
Shear Modulus, Msi (GPa)7.2 (50)
Poisson's Ratio0.36
Single phase/multiphaseTwo-phases: FCC and HCP
Contact Resistance (Cres), 30 gf, mΩ10
Cres, oxidized 1,000h@150°C, 30 gf, mΩ5
Cres, flowers of sulfur 720h@50°C, 30gf, mΩ450

HTA

Thin Strip and Foil

ParameterValue
Proportional Limit, ksi (MPa)165 (1120)
0.2% Offset Yield Strength, ksi (MPa)174 (1190)
Ultimate Tensile Strength, ksi (MPa)205 (1400)
Elongation to Failure, %4
Electrical Resistivity, Ω-cmf (µΩ-cm)43.2 (7.18)
Electrical Conductivity, %IACS24
Thermal Conductivity, (Btu/hr-ft-°F) W/m-k57.6 (99.6)
ParameterValue
Knoop Microhardness, HK460
Vickers Microhardness, HV460
Knoop Microhardness after 1kh@250°C, HK 440
Hot Ultimate Tensile Strength @250°C, Ksi (MPa) 187 (1270)
Hot Knoop Microhardness @250°C, % 3

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